Hybrid memory cube (HMC) and high-bandwidth memory (HBM) are memory interfaces designed to work with the latest microprocessors. The use of dynamic RAM (DRAM) dies to be used as a memory cache and main storage can be used in handling large data assets. The potential in 3D printing and optimizations in bandwidth and burst length for integrating DRAM for running various simulations by taking performance metrics can drive its high demand. The global hybrid memory cube and high-bandwidth memory report by Market Research Future (MRFR) contains developments in DRAM interfaces, extensive scope, computer architecture, and other growth opportunities for companies looking to expand during the period of 2017 to 2023 (forecast period). The COVID-19 pandemic and its impact on the industry has been explored in depth.

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Market Scope

The global hybrid memory cube and high-bandwidth memory market is expected to reach a value of USD 3.7 billion by 2023. It is expected to clock 35% CAGR throughout the forecast period.

The market is expected to perform exceptionally owing to the increased computational power of all processors. The HMC allows memory interfaces to use a common interface and avoid usual problems of logic inconsistency, error correction, resiliency and refresh rates, and performance. The development of a consortium by semiconductor manufacturers is likely to favor the market greatly. Memory support for edge computing and high-performance networking equipment such as FPGAs can drive the market demand till 2023.

Segmentation

The global hybrid memory cube and high-bandwidth memory market are segmented into memory type, product type, and application. On the basis of memory type, the segment is further classified into hybrid memory cube (HMC) and high-bandwidth memory (HBM). On the basis of product type the segment is further segmented into graphics processing unit (GPU), central processing unit (CPU), field programmable gate array (FPGA), application-specific integrated circuit, and accelerated processing unit.

The hybrid memory cube and high-bandwidth memory devices have applications in networking and telecommunication, high-performance computing (HPC), data centers, consumer electronics, and many others.

 Regional Analysis

The global hybrid memory cube and high-bandwidth memory market is studied for North America, Europe, Asia Pacific (APAC), and Rest-of-the-World (RoW).

Among the regions, the market of hybrid memory cube and high bandwidth memory is dominated by North America. The major factor contributing towards the growth of the market in North America is the high number of data centers and their application. There is also a strong demand for high-performance computing; wherein, HMC is expected to play a significant role. In addition to the higher concentration of data centers in North America region, faster adoption of newer technology in various applications, and presence of key players such as Amazon, Alphabet, and Microsoft are fueling the market. The U.S. is the major contributor to the growth of the market. The large concentration of companies and vendors dealing in hybrid memory cube and high bandwidth memory and rise in manufacturing activities.

On the other hand, the market in Europe is also expected to boom after the middle of the forecast period. Due to advancement in autonomous vehicles, the hybrid memory cube and high bandwidth memory are expected to contribute a significant amount to its development. However, APAC is expected to show the highest growth rate during the forecast period. Incremental updates to packages and large potential in AI can drive the market growth in the region.

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Competitive Outlook

Nvidia Corporation, Open-Silicon, Advanced Micro Devices, Inc., Xilinx, Inc., Samsung Group, Intel Corporation, Micron Technology, Inc., IBM Corporation, Fujitsu Ltd., and SK Hynix Inc. are prime players of the global hybrid memory cube and high bandwidth memory market.

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